I. Core Bottleneck: Supply-Kev thov tsis txaus hauv Optical Interconnects Tsav los ntawm AI Expansion
Kev loj hlob tawg ntawm AI suav tau nce qhov kev thov rau siab -cov ntaub ntawv xa mus ceev hauv cov chaw khaws ntaub ntawv. Txawm li cas los xij, silicon photonics kev koom ua ke kev daws teeb meem yog txwv los ntawm lawv cov khoom siv bandgap qauv thiab tsis tuaj yeem tsim lub teeb autonomously, ua rau lawv tso siab rau InP lasers ua lub teeb ci tseem ceeb. Raws li cov lus ceeb toom los ntawm kev tshaj tawm txawv teb chaws kho qhov muag loj heev Lumentum, tam sim no qhov tsis txaus ntawm InP lasers tseem hnyav dua li cov cim xeeb chips. Lawv cov khoom xa tuaj tam sim no ntau dua 30% qis dua cov neeg siv khoom xav tau, thiab qhov sib txawv txuas ntxiv mus. Qhov tshwm sim no qhia tau hais tias lub bottleneck rau AI txoj kev loj hlob tau hloov los ntawm "computing chips" mus rau "optical interconnects."
II. Muaj Lub Sijhawm Muaj Peev Xwm: Lub Qhov rai Breakout rau Peb Qhov Tseem Ceeb
Qhov tsis txaus ntawm InP lasers yog hloov kho tus nqi faib thoob plaws tag nrho cov kev lag luam kev sib txuas lus kho qhov muag, nthuav qhia cov sijhawm tseem ceeb hauv peb thaj chaw hauv qab no:
Upstream Core Raw Khoom:Kev tsim tawm ntawm InP hnyav heev nyob ntawm siab -purity indium. Raws li lub ntiaj teb tus tsim khoom loj tshaj plaws ntawm thawj indium (suav txog li 70% ntawm cov khoom siv thoob ntiaj teb), Tuam Tshoj tuav qhov txiaj ntsig zoo ntawm cov peev txheej kawg. Nrog InP tau suav nrog hauv kev tswj hwm kev xa tawm, txoj haujlwm tseem ceeb ntawm kev nce qib siab -purity indium thiab substrate cov khoom lag luam tseem ceeb ntxiv.
Midstream Optical Chips thiab Lasers:Cov tuam txhab kho qhov muag hauv tsev nrog IDM (Integrated Device Manufacturing) muaj peev xwm ua kom lawv cov kev tawg. Piv txwv li, cov lag luam hauv tsev tau ua tiav cov txheej txheem kev loj hlob epitaxial rau 6-inch InP-raws li lasers, nrog rau cov kev ntsuas kev ua haujlwm tseem ceeb mus txog qib siab thoob ntiaj teb. Qhov no yuav tsum txo tus nqi ntawm cov khoom siv kho qhov muag hauv tsev rau 60% -70% ntawm cov txheej txheem 3-nti, ua kom muaj kev hloov pauv hauv tsev.
Downstream Optical Modules thiab System Integration:Tuam Tshoj cov tuam txhab tam sim no nyob ib nrab ntawm kaum sab saum toj ntiaj teb optical module cov chaw muag khoom. Kev ntsib cov dej ntws tsis zoo, ua cov tuam txhab tsim kho qhov muag kho qhov muag tau nquag txhawb nqa cov ntawv pov thawj ntawm cov khoom siv hauv tsev InP substrates. Los ntawm kev siv lub "chip-} qauv" kev sib koom tes tsim, lawv tau ruaj ntseg cov saw hlau muaj kev nyab xeeb thiab maj mam hloov los ntawm ib qho - cov khoom tso tawm mus rau "kev sib txuas kho qhov muag" cov tshuab.
III. Technological Evolution: Supply Bottlenecks Accelerate the Adoption of New Technologies like CPO
Taug qab lub hwj chim fwj ntawm cov tsoos pluggable optical modules hais txog InP lasers, kev lag luam tau nrawm hloov mus rau kev sib koom ua ke Co-Packaged Optics (CPO) thev naus laus zis. CPO txo qis kev siv hluav taws xob thiab nce bandwidth ceev los ntawm co- ntim cov tshuab kho qhov muag nrog cov nti hloov. Txawm hais tias kev tsim khoom loj ntawm CPO tseem raug txwv los ntawm kev muab cov khoom siv hluav taws xob InP laser chips, qhov kev siv thev naus laus zis no yuav yuam kom cov saw hlau kev lag luam txhawm rau txhawm rau muaj peev xwm nthuav dav. Nyob rau hauv lub neej yav tom ntej, cov tuam txhab uas muaj peev xwm ua tau zoo hauv kev loj hlob ntawm epitaxial, chip manufacturing, los yog silicon photonics kev koom ua ke yuav tuav ib qho kev pib muaj zog nyob rau hauv qhov kev hloov kho thev naus laus zis no.
