Raws li lub teb chaws tsim khoom loj, Tuam Tshoj txoj kev lag luam sai sai tau ua rau muaj kev xav tau ntau ntxiv rau kev ua haujlwm ntawm ntau yam hlau thiab cov hlau tsis yog hlau hauv kev tsim khoom thiab kev nthuav dav sai ntawm daim ntawv thov ntawm cov khoom siv laser. Raws li ib tug tshiab "ntsuab" thev naus laus zis uas tau tshwm sim nyob rau hauv xyoo tas los no, laser processing technology yog tas li sim ua ke nrog ntau lwm yam thev naus laus zis los tsim cov thev naus laus zis tshiab thiab kev lag luam nyob rau hauv lub ntsej muag ntawm kev hloov pauv kev xav tau ntawm ntau yam kev lag luam.
Iav tau pom nyob txhua qhov chaw hauv tib neeg lub neej niaj hnub thiab yog ib qho ntawm cov ntaub ntawv tseem ceeb tshaj plaws uas ua rau muaj kev loj hlob ntawm tib neeg niaj hnub kev vam meej, muaj kev cuam tshuam ntev thiab cuam tshuam rau tib neeg niaj hnub no. Nws tsis yog tsuas yog siv rau ntau yam kev siv hauv kev tsim kho, tsheb, khoom siv hauv tsev thiab ntim khoom, tab sis kuj tseem yog cov khoom siv tseem ceeb hauv kev txiav-ntug xws li lub zog, biomedicine, cov ntaub ntawv thiab kev sib txuas lus, electronics, aerospace thiab optoelectronics. Drilling iav yog ib qho txheej txheem ntau thiab feem ntau yog siv rau hauv ntau hom kev lag luam substrates, zaub panels, civil iav, kho kom zoo nkauj, chav dej, photovoltaic thiab zaub npog rau kev lag luam hluav taws xob. Txawm li cas los xij, siab brittleness, siab hardness, tsis zoo cua sov dissipation, siab coefficient ntawm thermal expansion thiab siab chipping tau dhau los ua teeb meem tseem ceeb uas plague iav drilling tshuab.
Laser iav ua haujlwm muaj cov yam ntxwv hauv qab no.
1. ceev ceev, siab precision, zoo stability, tsis sib cuag ua, cov yield tus nqi ntau dua li cov txheej txheem ib txwm ua.
2. qhov tsawg kawg nkaus txoj kab uas hla ntawm lub khob qhov drilling yog 0.2 hli, thiab txhua qhov loj ntawm square, puag ncig thiab cov kauj ruam qhov tuaj yeem ua tiav.
3. siv lub vibration iav drilling txheej txheem, siv tib lub mem tes ntawm cov khoom siv substrate taw tes los ntawm qhov taw tes ua haujlwm, lub laser tsom ntsia tau tsim txoj hauv kev ntawm lub iav nrawm scanning txav, kom ua tiav cov khoom siv iav tshem tawm.
4. Cov txheej txheem hauv qab-rau-sab saum toj, qhov twg lub laser hla cov khoom siv kom pom tseeb ntawm cov khoom siv hauv qab, pib los ntawm hauv qab thiab tshem tawm cov khoom txheej los ntawm txheej txheej upwards. Tsis muaj taper nyob rau hauv cov khoom thaum lub sij hawm tus txheej txheem thiab lub sab saum toj thiab hauv qab qhov yog ntawm tib txoj kab uas hla, uas ua rau cov high precision thiab npaum "digital" iav drilling.
Laser iav ua haujlwm muaj cov yam ntxwv hauv qab no.
1. ceev ceev, siab precision, zoo stability, tsis sib cuag ua, cov yield tus nqi ntau dua li cov txheej txheem ib txwm ua.
2. qhov tsawg kawg nkaus txoj kab uas hla ntawm lub khob qhov drilling yog 0.2 hli, thiab txhua qhov loj ntawm square, puag ncig thiab cov kauj ruam qhov tuaj yeem ua tiav.
3. siv lub vibration iav drilling txheej txheem, siv tib lub mem tes ntawm cov khoom siv substrate taw tes los ntawm qhov taw tes ua haujlwm, lub laser tsom ntsia tau tsim txoj hauv kev ntawm lub iav nrawm scanning txav, kom ua tiav cov khoom siv iav tshem tawm.
4. Cov txheej txheem hauv qab-rau-sab saum toj, qhov twg lub laser hla cov khoom siv kom pom tseeb ntawm cov khoom siv hauv qab, pib los ntawm hauv qab thiab tshem tawm cov khoom txheej los ntawm txheej txheej upwards. Tsis muaj taper nyob rau hauv cov khoom thaum lub sij hawm tus txheej txheem thiab lub sab saum toj thiab hauv qab qhov yog ntawm tib txoj kab uas hla, uas ua rau cov high precision thiab npaum "digital" iav drilling.
