LPKF Laser & Electronics AG Los xa cov iav Core Phaj Laser Khoom rau ntau tus neeg Esxias cov neeg siv khoom

Ob peb hnub dhau los, German laser technology loj heev LPKF Laser & Electronics tshaj tawm tias nws yuav nthuav cov khoom siv laser rau cov txheej txheem iav-dhau-qhov (TGV) tseem ceeb hauv iav chipboard ntau lawm xyoo no.
Hauv kev xam phaj, LPKF CEO Klaus Fiedler tau tshaj tawm tias lub tuam txhab tau kos npe rau daim ntawv cog lus nrog cov neeg siv khoom tsim iav chipboards thiab yuav sai sai xa nws cov khoom siv laser. Tsis tas li ntawd, nws tau hais tias lub tuam txhab tau txais kev txiav txim thiab nug los ntawm ntau tus neeg siv khoom hauv Asia (tshwj xeeb yog Kaus Lim Qab Teb), thiab cov kev xav tau no yog rau kev tsim khoom tiag tiag, tsis yog rau kev tshawb fawb.
Lub tuam txhab German muaj nws tus kheej tshwj xeeb patented laser technology, Laser Induced Depth Etching (LIDE), uas tau siv rau Vitrian 5000 series ntawm cov cav tov nruab nrog Cov Txheej Txheem Los Ntawm iav Vias (TGV), txhim kho qhov ua tau zoo thiab qhov tseeb ntawm TGV ua. .
LPKF's breakthrough Laser Induced Depth Etching (LIDE) thev naus laus zis yuav hloov pauv kev lag luam nti, tshwj xeeb tshaj yog nyob rau hauv kev nrhiav kev ua haujlwm siab dua thiab txhim khu kev qha iav substrates.
Tam sim no, chip kev lag luam cov neeg muag khoom tau nquag nrhiav los hloov cov txheej txheem organic (xws li fiberglass reinforced epoxy / FR4) ntawm cov tsoos Flip-Chip Ball Grid Arrays (FC-BGAs) nrog iav. iav yog ib qho khoom siv zoo tshaj plaws los hloov vim nws qhov siab tawv, siab thermal stability, zoo rwb thaiv tsev zog thiab teeb liab kis ceev.
Hauv kev sib piv, iav yog nruj dua FR4, yog li nws tsis tshua muaj kev cuam tshuam rau thermal deformation thiab tso cai rau thaj tsam loj dua. Cov iav tseem tiaj tus, ua kom yooj yim rau kev tsim cov kab hluav taws xob zoo ntawm nws. Nws kuj muaj cov khoom zoo insulating. Nws muaj cov teeb liab poob qis, tab sis cov teeb liab ceev ceev. Nyob rau hauv high-frequency RF, qhov twg yuav tsum tau muaj kev khiav hauj lwm zaus, iav yog touted raws li cov khoom zoo tshaj plaws rau kev ua Circuit Court boards.
Tshwj xeeb tshaj yog, US chip loj Intel twb tau npaj yuav siv iav boards los ntawm 2030. Samsung Electronics 'cov khoom siv hluav taws xob Samsung Electro-Mechanics (Samsung Electro-Mechanics) tab tom thov kom nrawm txhim kho cov iav semiconductor, thiab xav kom tiav ntawm tus tsav. txoj kab kev tsim kho tau hloov mus txog rau lub Cuaj Hli, ib lub hlis twg ua ntej lub hom phiaj ua tiav thawj xyoo. Samsung Electro-Mechanics npaj yuav tshaj tawm cov qauv nti pob siv lub iav phaj hauv xyoo 2025, thiab tom qab ntawd ua lag luam tsim cov khoom siv no qee zaum ntawm 2026-2027.
Kev nthuav tawm tsis tu ncua ntawm cov kev pib tshiab los ntawm kev lag luam loj rau thaj chaw no tau txhawb kev lag luam kev ntseeg siab.
Txawm li cas los xij, tseem muaj ntau yam teeb meem rau kev tsim cov chipboards siv iav ua cov txheej txheem tseem ceeb - qhov loj tshaj ntawm cov iav los ntawm qhov (TGV) txheej txheem. Nyob rau hauv cov txheej txheem no, qhov yuav tsum tau punched nyob rau hauv lub khob kom txuas circuits. Tab sis cov khawb me me tsim nyob rau hauv cov txheej txheem tuaj yeem cuam tshuam qhov rigidity ntawm tag nrho cov iav substrate. Thaum tooj liab plating yog siv rau lub qhov los tsim cov circuits, cuaj feem kaum ntawm cov iav tawg, uas nyob rau hauv lem yuav tsum tau muab pov tseg, ua rau ib tug loj npaum li cas ntawm cov pov tseg, lub hauv paus hais tias.
LPKF's LIDE thev naus laus zis daws qhov teeb meem no los ntawm kev tswj hwm lub zog laser thiab cov qauv kev hloov pauv kom ua tiav sai, huv etching ntawm iav. Lub hauv paus ntsiab lus ntawm LPKF's Laser Induced Depth Etching (LIDE) kev daws teeb meem yog raws li hauv qab no: Lub teeb liab laser luv yog xa mus rau ib lub qhov hauv iav. Tom qab ntawd, lub zog siab photons (cov khoom ntawm lub teeb) raug xa mus rau cov cheeb tsam no, ua rau muaj kev hloov pauv ntawm cov iav ntawm cov chaw tshwj xeeb no - suav nrog kev hloov pauv ntawm qhov ntom ntom, kev tawg lossis tsim cov khoom siv tshuaj lom neeg, thiab hloov kho cov qauv siv lead ua. Vim tias cov cheeb tsam laser-irradiated yog etched sai dua, cov txheej txheem etching tuaj yeem ua tiav sai dua thiab raug, tsim cov qhov xav tau lossis lwm cov qauv hauv iav yam tsis muaj kev puas tsuaj rau thaj tsam ib puag ncig.
Cov thev naus laus zis tau siv rau ntawm qhov loj me rau Lepco's Vition 5000p qauv. Lub tuam txhab German hais tias lawv tau ua lag luam rau lawv cov LIDE thev naus laus zis tau ntev thiab tam sim no siv nws hauv kev tsim cov iav npog rau cov khoom siv foldable.LIDE yog cov cuab yeej patented uas LPKF tau tsim hauv tsev txog 10 xyoo dhau los, thiab cov khoom siv uas siv cov thev naus laus zis no yuav yog qhov tseem ceeb ntawm cov nyiaj tau los rau lub tuam txhab.
Ntxiv rau kev muab cov khoom siv laser, LPKF kuj tseem muaj cov kev pabcuam tsim khoom siv rau kev ua cov iav board, ib lub lag luam uas Fiedler piav qhia tau muab rau cov neeg siv khoom uas tsim cov khoom siv iav me me los yog kev sim rau cov neeg siv khoom los xyuas qhov zoo ua ntej siv cov khoom siv laser ntawm ib qho nplai loj. Nws hais tias qhov kev lag luam OEM no tsis yog tsuas yog muab lub tuam txhab nrog cov nyiaj tau los tsis tu ncua, tab sis kuj tseem ntxiv dag zog rau daim ntawv cog lus nrog nws cov neeg siv khoom.
Founded hauv 1976, LPKF yog lub hauv paus hauv Gabson, ze Hanover, lub teb chaws Yelemees. Nws cov khoom siv laser yog siv rau hauv ntau yam kev siv xws li luam tawm Circuit Board, microchips, hnub ci vaj huam sib luag thiab biopharmaceuticals. Raws li ib lub tuam txhab teev nyob rau hauv German Tshuag Txauv, LPKF tau tsim cov nyiaj tau los ntawm € 124.3 lab xyoo tas los.
Raws li qhov kev txiav txim siab no, LPKF tshaj tawm tias nws yuav ua kom muaj peev xwm ntau lawm ntawm nws cov tshuab laser hauv kev teb rau qhov kev thov loj hlob rau cov khoom ntim iav hauv kev lag luam semiconductor. Nrog rau kev nthuav dav kev lag luam rau iav chipboards, LPKF cia siab tias yuav ua tiav kev loj hlob ntau dua nyob rau xyoo tom ntej.