Solder pob yog ib txoj hauv kev tseem ceeb hauv cov txheej txheem niaj hnub peb lub laser soldering, ua ke nrog laser hlau thiab solder paste rau cov txheej txheem tseem ceeb hauv kev lag luam nruab nrab thiab me me. Shenzhen Zichen laser ua thawj lub tuam txhab lag luam koom nrog hauv kev tshawb fawb thiab kev txhim kho ntawm laser soldering daim ntaub ntawv, tau cog lus rau laser hlau, solder paste thiab solder pob vuam technology breakthroughs thiab industrialized daim ntaub ntawv. Cov khoom lag luam tseem ceeb muaj cov yam ntxwv ntawm "siab vuam raug, kev ua haujlwm siab, tsis sib cuag, ntsuab thiab tsis muaj kuab paug" thiab lwm yam. Cov txheej txheem laser solder pob hauv qab no, kom nkag siab tias lub pob solder ua li cas? Thiab daim ntawv thov thiab cov yam ntxwv ntawm cov pob solder.
01. Yuav ua li cas lub pob solder
Tin pob yog tsim los ntawm tin tetrachloride, uas yog purified los ntawm distillation, hydrolyzed rau tin hydroxide, thiab ces txo los ntawm kev hla hydrogen roj kom tau cov khoom purity siab. Nws yog tsuas yog siv los ua compound semiconductor doping ntsiab, high-purity alloys, superconducting solder, thiab lwm yam. Ob txoj kev tsim khoom feem ntau yog siv, uas yog, ntau txoj kev txiav thiab lub tshuab nqus tsev. Lub qub yog tsim rau cov kab loj loj solder npas, tom kawg yog ntau haum rau me me txoj kab uas hla solder npas, tab sis kuj yuav siv tau rau loj txoj kab uas hla solder npas. Lub cev thiab hluav taws xob cov khoom ntawm cov pob tin feem ntau yog xav tau ntom ntom, lub zog hloov pauv, lub zog hloov hluav taws xob, tensile lub zog, qaug zog lub neej thiab elongation. Ntxiv rau qhov no, txoj kab uas hla kev kam rau ua, qhov tseeb roundness, thiab cov ntsiab lus oxygen ntawm cov pob tin kuj pom tias yog cov cim tseem ceeb ntawm kev sib tw tam sim no hauv qib zoo ntawm cov pob tin.
02. Hom Tin Pob
Ordinary solder balls (Sn ntsiab lus los ntawm 2 [%) -100 [%), melting point kub ntawm 182 degree ~ 316 degree ); Ag-muaj cov khoom siv (cov khoom siv uas muaj 1.5 [%), 2 [ feem pua] lossis 3 [ feem pua] Ag, melting point kub ntawm 178 degree ~ 189 degree ); kub kub solder npas (muaj bismuth los yog indium chav kawm ntawv, melting point kub ntawm 95 degree ~ 135 degree); kub kub solder npas (melting point ntawm 186 degree -309 degree ).
03. Daim ntawv thov ntawm laser solder npas
Los ntawm nam ntawm cov khoom txuag: nyob rau hauv cov txheej txheem ib txwm soldering feem ntau siv cov soldering hlau taub los muab lub zog uas yuav tsum tau, tab sis nrog lub BGA solder pob yog siv los hloov cov pins nyob rau hauv lub IC tivthaiv pob qauv, thiaj li ua tau raws li cov hluav taws xob kev sib txuas. nrog rau kev sib txuas ntawm cov khoom siv sib txuas ntawm kev sib txuas. Nws cov txheej txheem thev naus laus zis tau siv dav hauv digital, ntse kev sib txuas lus electronics, satellite positioning systems thiab lwm yam khoom siv hluav taws xob.
Muaj ob hom tin pob daim ntawv thov, ib daim ntawv thov yog thawj theem ntawm kev sib txuas ntawm inverted nti (FC) ncaj qha mounted rau lub ntees siv, tin pob nyob rau hauv lub wafer txiav rau hauv lub nti ncaj qha mus rau lub liab qab nti, nyob rau hauv lub FC -BGA pob ua si ib nti thiab pob substrate hluav taws xob sib txuas; lwm daim ntawv thov yog qib thib ob ntawm kev sib txuas ntawm kev sib txuas, daim ntawv thov los ntawm cov khoom siv tshwj xeeb yuav yog me me tin pob nplej los ntawm cov nplej cog rau hauv pob substrate, los ntawm cua sov tin pob thiab cov substrate ntawm lub luag haujlwm ntawm kev sib txuas hluav taws xob. Los ntawm cua sov cov khoom siv, lawv raug khi rau cov phaj sib txuas ntawm lub substrate. Hauv IC ntim khoom (BGA, CSP, thiab lwm yam), lub nti yog soldered rau lub motherboard los ntawm cua sov hauv qhov cub reflow.
Kev txhim kho ntawm BGA / CSP cov pob ua raws cov qauv ntawm kev txhim kho thev naus laus zis thiab cov khoom siv hluav taws xob tsawg, uas muaj cov lus siv rau BGA rework, bga ntim , bga rework thiab BGA pob implantation. BGA pob zoo yuav tsum muaj qhov tseeb roundness, brightness, zoo conductivity thiab mechanical linkage kev ua tau zoo, pob txoj kab uas hla kam rau ua, tsis tshua muaj oxygen cov ntsiab lus, thiab lwm yam, thiab precision, advanced pob ntau lawm cov khoom, yog tus yuam sij rau txiav txim siab muab cov khoom zoo pob.
04. Khoom nta
Laser pob implantation vuam tshuab txais fiber ntau laser, sib koom ua ke nrog kev tswj hwm kev lag luam hauv lub rooj zaum ua haujlwm, nrog lub pob implantation mechanism kom ua tiav synchronization ntawm tin pob thiab laser vuam, nrog dual-chaw nres tsheb sib tham sib pub noj, thauj khoom, tshem tawm, tsis siv neeg tso, vuam synchronization, kom ua tau zoo tsis siv neeg vuam, zoo heev txhim kho cov efficiency ntau lawm, kom tau raws li cov qib precision Cheebtsam xws li bga chips, wafers, kev sib txuas lus pab kiag li lawm, lub koob yees duab ccm modules, VCM enameled coil modules thiab hu rau pob tawb, thiab lwm yam nrog rau cov nram qab no daim ntawv thov nta:
- Solder npas nrog qhov tsawg kawg nkaus txoj kab uas hla ntawm 60um nrog cov duab tso qhov system; ceev cua sov thiab yaj-poob txheej txheem, uas tuaj yeem ua tiav hauv 0.3S;
- Muaj feem xyuam rau ntau yam ntawm cov khoom siv solder, SnPb (lead-tin), SnAgCu (tin-silver-copper), AuSn (kub-tin alloy), thiab lwm yam. tuaj yeem txhawb nqa ib qho khoom thauj lossis array loading;
- Linear motor marble integrated platform nrog precision mus txog 1um;
- Flux-dawb, tsis-polluting, tsis-spattering, siab tshaj plaws hluav taws xob ntaus ntawv lub neej;
- Nws tuaj yeem txuas ntxiv nrog kev tshuaj xyuas lub pob solder, thiab tom qab kev tshuaj xyuas kev ua haujlwm.
