iav, raws li ib qho tseem ceeb ntawm cov khoom siv, yog siv nyob rau hauv ntau industries ntawm lub teb chaws kev khwv nyiaj txiag, xws li cov khoom siv hauv tsev, khoom noj khoom haus, kho kom zoo nkauj, electronics, crafts, optics, kev tsim kho, automotive, photovoltaic kev lag luam, thiab lwm yam. Nws yog me me li ob peb. micrometers ntawm cov ntxaij lim dej me me, lub laptop tiaj tus vaj huam sib luag, thiab loj npaum li cov iav loj loj siv hauv kev tsim khoom loj xws li tsheb, photovoltaic, thiab kev tsim kho kev lag luam.
Iav, raws li cov khoom siv nkig, ua rau muaj teeb meem loj thaum ua haujlwm. Kev lig kev cai, iav yog txiav siv cov cuab yeej carbide lossis pob zeb diamond, thiab cov txheej txheem txiav tau muab faib ua ob kauj ruam. Ua ntej, lub pob zeb diamond ntsis los yog carbide sib tsoo log yog siv los tsim kom muaj qhov tawg ntawm lub iav nto; Tom qab ntawd, siv tshuab txhais tau tias yog siv los faib cov iav raws cov kab tawg.
Scribing thiab txiav siv txoj kev no muaj ib tug xov tooj ntawm drawbacks; Kev tshem tawm ntawm cov khoom ua rau tsim cov chips, fragments, thiab microcracks uas degrade lub zog ntawm cov npoo txiav, yuav tsum muaj txheej txheem ntxuav ntxiv. Cov kab nrib pleb sib sib zog nqus los ntawm cov txheej txheem feem ntau tsis yog perpendicular rau iav nto vim hais tias cov kab sib faib tsim los ntawm cov neeg kho tshuab rog feem ntau tsis yog-perpendicular, thiab qhov poob ntawm cov txiaj ntsig vim yog siv cov khoom siv dag zog rau cov iav nyias kuj yog qhov tsis zoo.
Cov kev tsis txaus no tuaj yeem txhim kho los ntawm kev siv cov iav tsis muaj kev ntxhov siab thiab ntxiv kev txhim kho cov txheej txheem siv rau kev sib cais. Txawm li cas los xij, nws tseem tsis tuaj yeem zam qhov kev tsis sib haum xeeb ntawm txoj kab ntsug thiab kev tiv thaiv ntawm ntug chips / cracks. Txoj kev loj hlob ntawm laser technology muab kev daws teeb meem rau cov teeb meem zoo.
Tsis zoo li cov cuab yeej siv tshuab txiav, lub zog ntawm lub laser beam txiav iav hauv qhov tsis sib cuag. Lub zog heats li ib feem ntawm lub workpiece mus rau ib tug predefined kub. Cov txheej txheem cua sov sai sai no yog ua raws li kev ua kom txias sai sai, uas ua rau muaj kev ntxhov siab nyob rau hauv lub khob, uas ua rau muaj qhov tawg ntawm qhov kev taw qhia uas tsis muaj chips lossis tawg. Txij li thaum qhov tawg tsuas yog tshwm sim los ntawm tshav kub thiab tsis yog los ntawm kev siv tshuab, tsis muaj chips lossis microcracks tshwm.
Laser txiav cov npoo muaj zog dua li cov qauv sib tw thiab cov txheej txheem sib cais, thiab qhov xav tau kev ua tiav yog txo los yog tshem tawm. Tsis tas li ntawd, qhov tshwm sim ntawm cov iav tawg tuaj yeem zam tau tag nrho.
Nyob rau hauv cov ntaub ntawv ntawm laser txiav, nto ntawm lub iav yog qhab nia los ntawm cua sov thiab tom qab txias ntawm lub laser beam los ntawm kwv yees li 10 hli thiab cov iav yuav ces muab faib rau cov kev taw qhia ntawm cov qhab nia. Txij li thaum lub tshuab laser tsis tsim cov iav tawg, cov burrs feem ntau thiab qis zog ntawm cov npoo txiav raug zam, thiab tom qab polishing thiab sanding txheej txheem tsis tsim nyog. Dab tsi ntxiv, cov iav ua tiav los ntawm qhov no txhais tau tias muaj txog li peb zaug ntau dua shatter-resistant dua iav cais los ntawm cov qauv siv. Rau iav thicknesses txog li 20 hli, nws muaj peev xwm txiav tag nrho daim nyob rau hauv ib kauj ruam xwb. Splitting thiab tom qab polishing, sib tsoo thiab yaug yog tsis tsim nyog. Lub zog ntawm cov npoo txiav tuaj yeem ntsuas tau los ntawm kev ntsuas plaub-point dabtsi yog khoov los ntawm DIN-EN 843-1. Ib daim iav yog tsau rau ntawm ob lub chais, thiab nyob rau saum npoo ntawm lub khob ob ntxiv chais yog siv los tsim kom muaj qhov yuav tsum tau khoov quab yuam, nyob rau hauv uas lub iav yuav muab faib ua ob feem. Qhov kev ntsuam xyuas tau rov ua dua kwv yees li 100 zaug kom tau txais cov txiaj ntsig zoo thiab txhim khu kev qha rau qhov ua tau ntawm kev sib cais.
Feem ntau, laser txiav yog qhov kev xaiv rau cov txheej txheem siab ntim iav. Qhov zoo yog kev kub ceev thiab precision, nrog rau qhov yooj yim parameterization. Txawm li cas los xij, qhov twg ntau cov kab sib txawv yuav raug txiav thiab lub sijhawm ua haujlwm txaus, kev txiav monolithic yog ib txoj hauv kev zoo nkauj dua vim nws qhov txias txias thiab tsis muaj cov kauj ruam ntxiv. Nyob rau hauv ob qho tib si ib tug high quality txiav ntug yog tsim. Nws tuaj yeem pom tias laser txiav ntawm iav zoo kawg nkaus kom txuag tau lub sijhawm thiab tib lub sijhawm ua rau muaj kev nce qib hauv kev ua haujlwm zoo.
Hloov cov thev naus laus zis tshiab thiab ua pov thawj rau hauv cov kab ntau lawm rau cov khoom siv high-tech tsis yog ib txoj haujlwm yooj yim. Los ntawm cov neeg siv khoom pom, ua ntej kev siv, thev naus laus zis yuav tsum yog lub tshuab hluav taws xob, txhim khu kev qha uas tsis yog tsuas yog pov thawj zoo, tab sis kuj suav tias yog kev lag luam. Hauv kev xyaum, kev siv cov thev naus laus zis tshiab tsuas yog siv tau hauv ob qhov xwm txheej: kev tshaj tawm cov khoom tshiab yuav tsum muaj kev tsim khoom tshiab kom paub txog cov yam ntxwv tshiab lossis txo cov nqi tsim khoom los ntawm kev txo cov txheej txheem ua haujlwm, lossis cov khoom tsim tawm tam sim no ntsib kev lag luam. kev ntxhov siab uas yuav tsum tau txo qis los ntawm kev txhim kho loj hauv cov txheej txheem ntau lawm.
Hauv kev lag luam vaj huam sib luag vaj huam sib luag, nws tau siv tsib xyoos rau kev tshaj tawm ntawm laser txiav tshuab kom pom nws qhov chaw hauv cov kab ntau lawm, muab tias nws tau dhau ntau txhiab teev ntawm daim ntawv thov pov thawj ntawm ntau cov kab ua haujlwm. Nws yog tam sim no feem ntau txiav txim siab rau kev tsim cov khoom tshiab uas muaj kev pheej hmoo ntawm cov iav tawg, lossis hauv kev lag luam hluav taws xob rau kev tsim khoom ntawm kev sib txuas lus mobile cov khoom uas muaj iav, lossis lwm yam khoom uas muaj cov khoom tawg yooj yim uas muaj cov iav nyias, xws li sensors. , kov panels, los yog iav vaj tse.
Kev ua haujlwm feem ntau yog ua nyob rau hauv qhov chaw tsis muaj plua plav, xws li hauv kev lag luam biochemical, vim tias cov no yog cov rhiab heev rau cov khoom tsim los ntawm cov pa txiav lossis kev sib tsoo cov kauj ruam. Piv txwv li, cov ntaub ntawv substrate them nrog DNA codes (biochemical barcodes) los yog cov ntaub ntawv uas tau laser txiav rau hauv nplooj ntawv yog siv rau cov khoom kuaj. Rau laser txiav tshuab, cov ntawv cog lus tshaj plaws yog tam sim no kev lag luam khoom siv hauv tsev, kev lag luam huv huv, kev lag luam hnub ci thiab kev lag luam tsheb.
Ib yam li laser tshuab tau tsim ntau xyoo hauv kev lag luam hlau, laser txiav tshuab rau iav ua yuav txuas ntxiv mus; thev naus laus zis yuav siv ntau yam kev siv rau cov khoom sib txawv, hloov cov txheej txheem ib txwm siv.
Raws li cov thev naus laus zis tshiab, laser txiav yuav siv ntau dua yav tom ntej hauv ntau lub iav kev lag luam xws li cov khoom siv hauv tsev, cov khoom siv huv, kho kom zoo nkauj, hluav taws xob, khoom siv tes ua, optics, kev tsim kho, tsheb, photovoltaic thiab lwm yam. Ntxiv nrog rau laser txiav iav, muaj ntau lwm yam thev naus laus zis rau laser ua cov iav uas twb tau nce qib thiab siv, xws li drilling thiab chamfering, nrog rau kev tshem tawm txheej.
